Patent writer writing vacuum metallization metallisation

In general, the text of U.S. Patents is NOT covered by copyright. (See link below about the lack of copyright for U.S. Patents.) Please estimate a fee to cut and paste information from the existing patents, prior art, to form the basis for a new patent. I will liberally use your information as a draft to write a new patent. And of course I will write the claims. I would like this project done within 7 days. The information that you cut and paste and compile will define materials and processes for the specifications. I suggest using this format : Patent “1234123” teaches "(cut and paste information) " We have already reviewed much of the prior art, and can provide you with an Information Disclosure Sheet with a list of about 25 prior art patents to cut and paste. You may need to look at other patents as well to compile a comprehensive cut and paste specification. I predict that the information that you cut and paste will consist of 20 – 50 double spaced pages. Here is an outline of the portions of the patent I would like you to do : MILESTONE 1 : PRIOR ART, DISADVANTAGES : Liquid disposal. Emphasize that due to stricter laws, ALL liquids which are contaminated with metals and etchants must be disposed of as hazardous, which is very expensive. Waste disposal Toxic or irritating or sensitizing resist materials SPECIFICATIONS : Vacuum metallization, chemical vapor deposition, physical vapor deposition Vacuum coated materials : aluminum, metals, semiconductors, organic semiconductors, polymers Substrates, flexible Substrates, rigid MILESTONE 2 : Process continuous, roll to roll Process batch Describe the typical handling processes for a continuous high speed vacuum coating "printing press". Describe printing of resist inks. Describe positive resist, negative resist. List and briefly describe common printing processes. List common printing oriented heating elements : Hot air, infrared, xenon flash, impinging hot air, ultraviolet. Milestone 3 : Describe uses for demetallized film and 3d objects : transponders, chips, antennas, capacitors, cicuit boards, RFID, NFC etc. Describe the use of sticky rollers to remove unwanted aluminum from the film web. [login to view URL] cleans down to 1 micron Describe air blow off and vacuuming of dust off of the web on a printing press Describe uTm, that is microtransfer printing, from Xia & Whitesides paper about Soft Lithography : [login to view URL] Note that the attached file 1stphase... is an early draft of the IDS and has been replaced with a more focused IDS. IN YOUR REPLY, PLEASE ANSWER THIS SCREENING QUESTION : Besides the United States Patent and Trademark Office database, please advise the best online database for U.S. Patent information??? Thank you for reading this offer. Thank you for your support. Allen. https://www.freelancer.com/users/l.php?url=https%3A%2F%2Fbooks.google.com%2Fbooks%3Fid%3D5gCrDAAAQBAJ%26amp%3Bpg%3DPA194%26amp%3Blpg%3DPA194%26amp%3Bdq%3Ddrawings%2Bof%2Ba%2Bpatent%2Bare%2Btypically%2Bnot%2Bsubject%2Bto%2Bcopyright%2Brestrictions%26amp%3Bsource%3Dbl%26amp%3Bots%3DPWub5upSwe%26amp%3Bsig%3DFc5O8OEtv2OcSP36w9_Xja3jqB8%26amp%3Bhl%3Den%26amp%3Bsa%3DX%26amp%3Bved%3D0ahUKEwjJ68Gh2LXTAhXi64MKHYV_BBIQ6AEISjAG%23v%3Donepage%26amp%3Bq%3Ddrawings%2520of%2520a%2520patent%2520are%2520typically%2520not%2520subject%2520to%2520copyright%2520restrictions%26amp%3Bf%3Dfalse&sig=43c8301d37d199cf6e218a9e7431dd4b3e2f70ed10ee2ded3fd8356ab2610723