• Was a Scientist for the Metals group in an Electronics Research Centre, with a team of scientists in developing new products in the areas of lead-free solders.
• Worked with, Analytics group, addressing customer issues, solutions and reporting the on analyzing electronic component failures.
• Materials Scientist having strong analytical and leadership skills and excellent knowledge on search engines related to Patents, Technical Journals other related articles and other technical data with over 6 years of experience in materials research.
• Areas of expertise include alloy design, low and high-temperature solder alloys for electronic packaging materials, fluxless solders for variety of the applications in electronic industry, thin films.
• Core competency knowledge such as electron microscopy, mechanical testing, thermal analysis, to address process-structure-property relationships in various engineering alloys.
• Knowledge on different components related to Intellectual property rights, like Patents, Copyright, Management of Intellectual Property Rights.
Experience with failure analysis group – Problem solving to analyze root cause of failure in electronic components in service, for various global customers (HP, Seagate, Creative, APC, Bergquist, Jabil), using various analytical characterization techniques.
Experience in IP landscape, journals, other technical related manuscripts, Good presentation skills, Strong track record of innovation and technical mentoring.
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