Looking for someone with good solid background in thermal simulation. We are designing a package for a camera core. The sensor will be integrated with an image processing CMOS ASIC using a PCBA. The assembly will then be house in ceramic base package, capped with a few possible choices of material. We need thermal simulation to be perform on the package based on the selection of material for the housing and also the interface material for heat spreading. The thermal simulation is to determine the best combination that will result in 0 or near 0 thermal gradient of the device across desired working temperature.
21 freelanceria on tarjonnut keskimäärin %project_bid_stats_avg_sub_26% %project_currencyDetails_sign_sub_27% tähän työhön
ibhave great experience in finite element analysis ,i can perform non linear simulations of thermal conditions of camera casing lets discuss details in chat budget is negotiable upon pronlem clarification