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We are developing a compact, reusable camera engine (the CVE) for use across multiple applications. The CVE is a two-board stacked module that interfaces with a customer-furnished 640×512 focal plane array (FPA) and outputs processed 14-bit video via a standardized 70-pin connector. A two-board stacked module (≤26×26×12 mm) consisting of: Board 1 — Sensor Interface (passive) A passive PCB that accepts the customer-furnished FPA in a 32-pin LCC ceramic socket and routes all signals and power rails to a 30-pin board-to-board stacking connector (Hirose DF40, 2.0 mm stack height). No active components. Includes sensor-specific filter capacitors, an SD0 pull-up resistor, and a DTEMP analog passthrough with series protection resistor. Board 2 — Engine Board The active processing board. Must include: • Processing core (see Section 4 — architecture TBD by contractor at M1) • Four power regulators: 11 V boost (VDET), 3.3 V low-noise LDO (AVDD), 3.3 V standard LDO (DVDDH), 1.8 V LDO (DVDD), plus power sequencer • UART header (always populated) — primary control interface • 70-pin Hirose DF40 (bottom-mount) — platform output interface • Debug provisions (DNP in production): USB-C, USB FS bridge IC, rail monitor ADC, 3× status LEDs
Projektin tunnus (ID): 40337448
15 ehdotukset
Etäprojekti
Aktiivinen 13 päivää sitten
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Rekisteröinti ja töihin tarjoaminen on ilmaista
15 freelancerit tarjoavat keskimäärin $4 399 USD tätä projektia

Hello, With me at the helm, your Compact Reusable Camera Engine project is poised for supreme success! My name is Mirza Muhammad and I'm a seasoned electrical engineer with extensive experience in Arduino, Circuit Design, Electronics, Embedded Systems and more. I have successfully designed and developed numerous compact modules and custom processing boards which aligns perfectly with your camera engine needs. Rest assured that I can translate your stated requirements (such as a 640×512 FPA) into highly-efficient functional reality - keeping the final product both compact (≤26×26×12mm) and reusable. What sets me apart from others is my strong background not only in engineering but also in Software Development. This means I can comprehensively understand the hardware intricacies of your Camera Engine project while also bringing a software programming approach to the development process. This valuable amalgamation of skills enables me to optimize the board layout, integrate requisite module stacks, manage power sequencing, cater to signal processing needs and adhere to all other specifications so that you're left with nothing but a high-performance proprietary device compliant with industry standards. Consider this engagement in terms of ROI - not just Return on Investment but rather Reachable Objectives Implemented. The mission of my company, Live Experts®, aligns seamlessly with your needed CVE - "transforming your ideas into realit Thanks!
$5 000 USD 1 päivässä
8,3
8,3

Hi, Your CVE brief is well defined, and this is the kind of mixed-signal embedded hardware project we handle at MHTechFusion. We can support the full development flow: architecture selection, compact stacked PCB design, low-noise power design, sequencing/protection, bring-up, and firmware development. Our likely recommendation for Rev. A would be Option B (small capture FPGA + STM32H7 class MCU). It offers a practical balance between deterministic sensor timing, processing flexibility for NUC/DRC/AGC, manageable firmware complexity, and controlled BOM/risk. We are comfortable with: Passive sensor interface PCB around the 32-pin LCC package 4-rail low-noise power tree with strict sequencing VDET protection with hard over-voltage safety strategy Dense 4–6 layer layout under tight mechanical constraints Hardware readiness validation before FPA insertion Firmware / RTL delivery with proper documentation We fully understand the sensitivity of the customer-furnished FPA and agree with treating M3.5 as a strict gate. Rail verification at the sensor socket, timing validation, and documented ESD-safe handling should all be completed before sensor integration. Our preferred EDA tool is Altium Designer. We can quote this milestone-wise and align the architecture decision early in M1 based on your final sensor timing/package details and system priorities. Sardar (CEO MHTechFusion)
$5 000 USD 60 päivässä
8,3
8,3

Since 2003 I am working in Digital Electronic. So more than 18 years of experience in Electronics. Arduino NANO/UNO/MEGA, ESP32 and Raspberry PI to build a digital device to read sensor data and send it to the web server, motor control, control relay switches and LEDs. More than 5(five) years of experience in Arduino design and build. If you want an excellent and error-free project delivery, then send a message to me, please. Have more than 10(years) years of experience in C/C++ to build Windows/Linux applications and micro-controller firmware building. If you want a good job delivery, then send a message to me, please. Since 1995 I have been working on Analog and Digital Electronics to build any kind of device. I have build lots of devices. So more than 20 years of experience on Electronics. Including power supply design. Any kinds of schematic and PCB design. Expert PCB design in EasyEDA Pro IDE.
$5 000 USD 45 päivässä
6,7
6,7

I can design your compact CVE two-board stacked module with a strong focus on signal integrity, miniaturization, and manufacturability. I have solid experience in high-density PCB design, FPGA/SoC-based embedded systems, and mixed-signal layouts. For the Sensor Interface board, I will ensure clean routing from the 32-pin LCC socket to the DF40 connector with proper filtering and protection. For the Engine Board, I will propose an optimized architecture (FPGA or SoC) suitable for 14-bit video processing and real-time performance. Power design will include low-noise LDOs and a stable boost regulator with proper sequencing and isolation. Special attention will be given to stack-up planning, grounding strategy, and EMI control within the 26×26 mm constraint. The 70-pin output interface and UART control will be cleanly integrated with debug provisions (USB-C, LEDs, monitoring). I will deliver complete schematics, PCB layout, BOM, and manufacturing-ready Gerbers. Design will be optimized for repeatability across multiple applications as required. I can also support bring-up, testing, and future revisions. Let’s proceed to finalize architecture and start M1.
$3 660 USD 7 päivässä
6,7
6,7

I’m excited to propose my expertise for developing a compact, reusable camera engine tailored to your requirements, with a strong focus on efficiency, modularity, and high-performance image processing. My approach begins with analyzing your target use cases—whether for mobile, embedded systems, or desktop applications—and designing a lightweight, scalable architecture that supports core features such as image capture, real-time processing, and flexible output handling. I will ensure the engine is built with clean abstractions, allowing easy integration with different hardware interfaces and camera modules while maintaining optimal performance and low resource consumption. To maximize reusability, I will structure the engine as a modular framework with well-defined APIs, enabling seamless customization and future enhancements. This includes support for plug-and-play components such as filters, encoding pipelines, and AI-based enhancements if required. I will also provide thorough documentation, testing, and performance optimization to ensure stability across different platforms. My goal is to deliver a robust, developer-friendly camera engine that can be reused across multiple projects, reducing development time while maintaining consistent, high-quality results.
$3 000 USD 7 päivässä
4,1
4,1

Hi, Thanks for sharing the details—this is a clean and well-constrained design. The two-board architecture is sensible for modularity and reuse, especially separating the passive sensor interface from the processing engine. The size constraint is tight but achievable with careful stack-up and component selection, particularly around power regulation and connector placement. From my perspective, the key challenges will be thermal management, power integrity (especially the 11V boost and low-noise AVDD), and ensuring signal integrity across the board-to-board interface. Early definition of the processing architecture will also be important to avoid rework. Overall, this looks like a solid foundation, and I’d be happy to support the hardware design and integration. Best regards,
$5 000 USD 25 päivässä
1,1
1,1

⭐⭐⭐⭐⭐ ✅Hi there, hope you are doing well! I have recently completed a project involving a compact multi-board embedded system with sensor interfacing and precise power regulation, facilitating seamless integration and video data processing. Ensuring meticulous PCB layout and robust power sequencing is the most critical part to successfully deliver this compact and reusable camera engine. Approach: ⭕ I will design and layout the two-board system following your specs with careful stack height management ⭕ Develop the sensor interface board with passive components and signal routing ⭕ Implement the engine board with required power regulators, UART control, debug interfaces, and output connectors ⭕ Validate signal integrity, power sequencing, and communication interfaces with thorough testing ⭕ Coordinate closely with you for architecture decisions by M1 milestone ❓Could you clarify the preferred processing core architecture for the engine board? I am confident in delivering a high-quality, compact camera engine solution that meets your size and performance targets within your timeline. Looking forward to collaborating! Best regards, Nam
$4 000 USD 30 päivässä
0,0
0,0

Having developed modular embedded vision systems for both high-end robotics and compact industrial inspection tools, I immediately recognize the engineering complexity behind a reusable camera engine like the CVE. My experience focuses on balancing high-performance image processing with the strict thermal and spatial constraints inherent in miniaturized systems, ensuring that "reusable" translates to a truly adaptable hardware platform across varied integration environments. I have previously delivered similar modular imaging modules where power efficiency and ruggedization were paramount to the project's long-term success. To build a robust foundation for the CVE, I will architect the system using a high-throughput ISP pipeline—likely utilizing platforms like the Ambarella CV-series or an FPGA-based backend—to ensure low-latency processing and MIPI CSI-2 sensor compatibility. My workflow involves rigorous high-speed PCB design with a focus on signal integrity and EMI shielding to prevent noise in the compact footprint, combined with advanced thermal simulation to prevent throttling during high-bitrate recording. I will also prioritize a standardized API layer and driver stack, allowing the engine to interface seamlessly with different host controllers via PCIe or USB 3.0, ensuring the engine is truly "plug-and-play" for your secondary applications. What are the specific dimensions of the target footprint, and do you have a preferred CMOS sensor for the initial prototype? Additionally, would you like the engine to support on-board AI acceleration for edge analytics, or is the focus strictly on high-fidelity raw imaging and encoding? I am available to discuss the technical roadmap further via chat or a quick call to ensure our design goals are perfectly aligned before we begin the schematic phase.
$4 832 USD 21 päivässä
0,0
0,0

I'm excited to bid on your Compact Reusable Camera Engine Development project. Based on your requirements, I'll design a two-board stacked module with a passive Sensor Interface Board and an active Engine Board, meeting the specifications for power regulators, UART header, and debug provisions. I'd love to discuss the project's architecture and timelines with you.
$5 000 USD 5 päivässä
0,0
0,0

Hello, This project is exactly the kind of system-level design I enjoy—compact, high-performance embedded hardware with strict constraints and real-world integration requirements. I have solid experience in multi-layer PCB design, embedded systems, and mixed-signal routing, including sensor interfaces and high-speed board-to-board communication. Your two-board CVE architecture is clear, and I can design both the passive sensor interface and the active engine board to meet size, signal integrity, and reliability requirements. For the Engine Board, I can define a suitable processing core (ARM-based MCU or FPGA depending on throughput needs), implement clean power architecture (low-noise LDOs, boost regulation, sequencing), and ensure stable handling of 14-bit video output. I’ll also carefully design the Hirose DF40 stacking and 70-pin interface for robust connectivity. I pay close attention to signal integrity, grounding strategy, and thermal constraints, especially in compact stacked modules like this. You’ll receive complete schematics, PCB layout, and production-ready files, along with clear documentation. I’m ready to start and would be happy to discuss architecture choices for M1. Best regards, Enock
$3 700 USD 7 päivässä
0,0
0,0

Brooklyn, United States
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Liittynyt toukok. 7, 2023
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