I was able to implement in ANSYS APDL a moving and pulsed heat generation source in order to describe the laser effect on a silicon chip during a cutting process. In ansys I can only describe the thermodynamics of the problem. I can get the temperature maps but not the phase change solid, liquid,vapour.
I would like to implement the same problem in FLUENT in order to describe now the evaporation and melt behavior of Silicon. So I want to create a UDF for the heat generation source, whic has to be pulsed and moving along the cutting line.
Heat source is a gaussian pulse 40ns long, with 10kHz repetition rate and moving with speed 10mm/sec.
I want to take into account also for the plasma absorption and I want to describe the phase change and evaporation problem. Do you think you can solve such a problem?
Please let me know.