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Hi, I’m looking for a skilled **Electromagnetic/Signal Integrity (SI) Simulation Engineer** with strong hands-on experience in **Ansys SIwave**. The project involves PCB-level signal integrity and electromagnetic simulations, including tasks such as: * SI/PI analysis and simulation in Ansys SIwave * High-speed PCB/interconnect analysis * Impedance, crosstalk, insertion/return loss, and transmission-line analysis * Via, stack-up, and routing optimization * Identifying and resolving SI/EMI issues * Interpreting simulation results and providing engineering recommendations **Requirements:** * Proven experience with Ansys SIwave and Ansys Electronics Desktop * Strong understanding of high-speed PCB design and signal integrity * Experience with realistic PCB models, stack-ups, ports, material properties, and simulation setup * Ability to clearly explain simulation results and recommend design improvements * Please share examples of similar SIwave projects you have completed If you have strong practical experience in **Ansys SIwave**, please send your profile, relevant project examples, availability, and hourly/project rate.
Project ID: 40650355
5 proposals
Remote project
Active 6 days ago
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5 freelancers are bidding on average ₹1,685 INR/hour for this job

Hello, I have around 20 years of professional experience in electronics industry and extensive knowledge in Circuit/Schematic design, PCB design, SI and PI. Strong knowledge of multi-layer PCB design, RF design, High speed & HDI (High Density Interconnecting drills) designs, Mixed signal (Analog and Digital) design, EMI/EMC Compliances, Familiar with DFM & DFA best practices, Signal Integrity and Power Integrity analysis, electrical engineering and electronic components - make me the perfect person for this job. Note: Please initiate a message in freelancer to share the samples. I cannot message you for the first time from my side on this platform.
₹1,800 INR in 25 days
7.0
7.0

Hi I can help with SIwave/Ansys Electronics Desktop analysis, including PCB/package electromagnetic modeling, signal/power integrity evaluation, meshing, boundary setup, simulation, and post-processing. I have experience with Ansys-based electromagnetic and FEA workflows and can provide technically reliable results with clear interpretation and documentation. Could you share the SIwave model/files and the specific analysis requirements or outputs you need? Best regards, Arati M.
₹1,875 INR in 40 days
6.0
6.0

Hi, I can support your PCB-level SI/PI and electromagnetic simulation work in Ansys SIwave and Ansys Electronics Desktop. My approach will be to first review your PCB files, stack-up, materials, high-speed nets, ports, vias, routing constraints, and target impedance requirements. Then I’ll set up SIwave simulations for impedance, crosstalk, insertion/return loss, return path, PDN/PI behavior, and EMI-related risk areas. I’m comfortable with Ansys SIwave, AEDT, high-speed PCB analysis, stack-up validation, transmission-line behavior, via optimization, routing review, material setup, port definition, and engineering recommendation reports. Deliverables: * SI/PI simulation setup * Stack-up and material review * Impedance analysis * Crosstalk analysis * Insertion/return loss results * Via and routing recommendations * PDN/PI observations * EMI/SI issue summary * Clear report with improvement actions I’ll focus on practical simulation results, clear interpretation, and actionable PCB design improvements instead of only raw plots. Best regards Ankit
₹1,500 INR in 40 days
3.9
3.9

Hi there, Your SIwave project aligns directly with my core domain in high-frequency EM/RF modeling and Signal/Power Integrity analysis. Because SIwave shares solver foundations and workflow logic with ANSYS HFSS, I can execute your project immediately without a learning curve on the underlying physics: S-Parameter & Extraction: Full 3D/2.5D board-level S-parameter extraction, differential/single-ended impedance profiling, and crosstalk analysis. DC/AC Power Integrity: IR drop analysis, current density mapping, and decoupling capacitor placement optimization. Stackup & Material Definition: Accurate modeling of frequency-dependent dielectric loss, copper roughness, and multi-layer stackups. Cross-Tool Validation: Native familiarity with HFSS and CST to cross-verify critical high-frequency structures or complex transitions if needed. Deliverables: Complete SIwave project files (.siw) Full S-parameterTouchstone files (.sNp) for system-level circuit co-simulation Comprehensive PI/SI simulation report detailing impedance plots, IR drop heatmaps, and mitigation recommendations
₹2,000 INR in 40 days
2.1
2.1

I’m a Mechanical Design Engineer specializing in CAD, 2D/3D modeling, CNC Programming, 3D Printing, FEA simulations, stress analysis, and technical report writing. With strong command of tools like SOLIDWORKS, FUSION 360, AUTOCAD, ANSYS, and ABAQUS, I bring both precision and creativity to every project. I’m committed to delivering high-quality results on time, with attention to detail and engineering excellence. Let’s connect and discuss how I can help bring your project to life!
₹1,250 INR in 40 days
1.4
1.4

Mumbai, India
Member since Nov 12, 2025
₹37500-75000 INR
$250-750 USD
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$25-50 USD / hour
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$30-250 USD
$250-750 USD
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$250-750 USD
₹1500-12500 INR